layers.csv
The layers.csv file is a file where users can edit and modify layer information to their foundry.
Rules when filling the table:
The
NAMEof the layers has to be all capitals.The number of
LAYERhas to be consistent with the description ofPROCESS.The number of
DATATYPEhas to be consistent with the description ofPURPOSE.
The file content format is as follows:
From foundry ( Users must check
LAYERandDATATYPEwith their foundry to match the CAD layer information)
LAYER |
DATATYPE |
NAME |
DESCRIPTION |
PROCESS |
PROCESS_DESCRIPTION |
PURPOSE |
PURPOSE_DESCRIPTION |
|---|---|---|---|---|---|---|---|
1 |
1 |
FWG_COR |
Full Etch waveguide core |
FWG |
COR |
Waveguide core |
|
1 |
2 |
FWG_CLD |
Full Etch waveguide cladding |
FWG |
Full etch |
CLD |
Waveguide cladding |
1 |
4 |
FWG_TRE |
Full Etch waveguide trench |
FWG |
Full etch |
TRE |
Waveguide trench |
1 |
5 |
FWG_HOL |
Full Etch waveguide hole lattice |
FWG |
HOL |
Waveguide hole lattice |
|
2 |
1 |
SWG_COR |
Shallow Etch waveguide core |
SWG |
COR |
Waveguide core |
|
2 |
2 |
SWG_CLD |
Shallow Etch waveguide cladding |
SWG |
Shallow etch |
CLD |
Waveguide cladding |
2 |
4 |
SWG_TRE |
Shallow Etch waveguide trench |
SWG |
Shallow etch |
TRE |
Waveguide trench |
2 |
5 |
SWG_HOL |
Shallow Etch waveguide hole lattice |
SWG |
Shallow etch |
HOL |
Waveguide hole lattice |
3 |
1 |
MWG_COR |
Medium Etch waveguide core |
MWG |
Medium etch |
COR |
Waveguide core |
3 |
2 |
MWG_CLD |
Medium Etch waveguide cladding |
MWG |
Medium etch |
CLD |
Waveguide cladding |
3 |
4 |
MWG_TRE |
Medium Etch waveguide trench |
MWG |
Medium etch |
TRE |
Waveguide trench |
3 |
5 |
MWG_HOL |
Medium Etch waveguide hole lattice |
MWG |
Medium etch |
HOL |
Waveguide hole lattice |
20 |
3 |
NP_DRW |
NP, for MOD slab, Ge etc. |
NP |
DRW |
Drawing |
|
21 |
3 |
PP_DRW |
PP, for MOD slab, Ge etc. |
PP |
DRW |
Drawing |
|
23 |
3 |
N_DRW |
N type light doping |
N |
N type light doping |
DRW |
Drawing |
24 |
3 |
P_DRW |
P type light doping |
P |
P type light doping |
DRW |
Drawing |
25 |
3 |
N2_DRW |
N2 type light doping 2 |
N2 |
DRW |
Drawing |
|
26 |
3 |
P2_DRW |
P2 type light doping 2 |
P2 |
DRW |
Drawing |
|
27 |
3 |
NPP_DRW |
N++ implement |
NPP |
DRW |
Drawing |
|
28 |
3 |
PPP_DRW |
P++ implement |
PPP |
P++ implant |
DRW |
Drawing |
29 |
3 |
GE_DRW |
Germanium epitaxy |
GE |
DRW |
Drawing |
|
30 |
3 |
SIL_DRW |
Silicide area |
SIL |
Silicide area |
DRW |
Drawing |
31 |
3 |
TIN_DRW |
TiN heater |
TIN |
DRW |
Drawing |
|
32 |
3 |
CONT_DRW |
Contact |
CONT |
Contact |
DRW |
Drawing |
33 |
3 |
M1_DRW |
Metal 1 |
M1 |
DRW |
Drawing |
|
34 |
3 |
VIA1_DRW |
Via 1 on M1 |
VIA1 |
DRW |
Drawing |
|
35 |
3 |
M2_DRW |
Metal 2 |
M2 |
Metal 2 |
DRW |
Drawing |
36 |
3 |
VIA2_DRW |
Via 2 on M2 |
VIA2 |
VIA2 on M2 |
DRW |
Drawing |
43 |
3 |
MT_DRW |
Metal Top |
MT |
DRW |
Drawing |
|
50 |
11 |
PASS_EC |
Passivation, open EC |
PASS |
EC |
||
50 |
12 |
PASS_GC |
Passivation, open GC |
PASS |
Passivation open window |
GC |
|
50 |
13 |
PASS_MT |
Passivation, open MT |
PASS |
MT |
||
51 |
3 |
TH_ISO_DRW |
Thermal isolation |
TH_ISO |
Thermal isolation |
DRW |
Drawing |
52 |
3 |
DT_DRW |
Deep Trench for edge coupler |
DT |
Deep Trench for edge coupler |
DRW |
Drawing |
55 |
3 |
LABEL_DRW |
Label to print on FWG |
LABEL |
Label to print on FWG |
DRW |
Drawing |
56 |
30 |
TEXT_NOTE |
Text layer, not to print on wafer |
TEXT |
Text, not to print on wafer |
NOTE |
Note |
81 |
3 |
M1KO_DRW |
Tilling keep-out for M1 |
M1KO |
Tilling keep-out for M1 |
DRW |
Drawing |
82 |
3 |
MTKO_DRW |
Tilling keep-out for MT |
MTKO |
Tilling keep-out for MT |
DRW |
Drawing |
83 |
3 |
SIKO_DRW |
Tiliing keep-out for Silicon |
SIKO |
Tiliing keep-out for Silicon |
DRW |
Drawing |
From PhotoCAD ( These layers are for testing, LVS, DRC and error mark when generating layout, we suggest users not to modify the information od these layers. However, if these layers’
LAYERandDATATYPEconflicts with the above layers, users are mandatory to modify them to another number.)
LAYER |
DATATYPE |
NAME |
DESCRIPTION |
PROCESS |
PROCESS_DESCRIPTION |
PURPOSE |
PURPOSE_DESCRIPTION |
|---|---|---|---|---|---|---|---|
60 |
21 |
IOPORT_OREC |
Optical port, for testing |
IOPORT |
Port, for testing |
OREC |
Optical |
60 |
22 |
IOPORT_EREC |
Electrical port, for testing |
IOPORT |
Port, for testing |
EREC |
Electrical |
70 |
30 |
PINREC_NOTE |
Pin rectangle, for LVS, DRC |
PINREC |
Pin rectangle, for LVS, DRC |
NOTE |
Note |
70 |
31 |
PINREC_FWG |
Pin rectangle, for LVS, DRC |
PINREC |
Pin rectangle, for LVS, DRC |
FWG |
Full etch |
70 |
32 |
PINREC_SWG |
Pin rectangle, for LVS, DRC |
PINREC |
Pin rectangle, for LVS, DRC |
SWG |
Shallow etch |
70 |
33 |
PINREC_MWG |
Pin rectangle, for LVS, DRC |
PINREC |
Pin rectangle, for LVS, DRC |
MWG |
Medium etch |
70 |
41 |
PINREC_TEXT |
Pin rectangle, for LVS, DRC |
PINREC |
Pin rectangle, for LVS, DRC |
TEXT |
Text |
71 |
30 |
FIBREC_NOTE |
Fiber rectangle, for LVS, DRC |
FIBREC |
Fiber rectangle, for LVSS, DRC |
NOTE |
Note |
72 |
30 |
FIBTGT_NOTE |
Fiber Target for LVS |
FIBTGT |
Fiber Target for LVS |
NOTE |
Note |
80 |
30 |
DEVREC_NOTE |
Device rectangle, for LVS, DRC |
DEVREC |
Device rectangle, for LVS, DRC |
NOTE |
Note |
90 |
30 |
PAYLOAD_NOTE |
Design area |
PAYLOAD |
Design area |
NOTE |
Note |
91 |
35 |
FLYLINE_MARK |
Flyline for insufficient space in AutoLink |
FLYLINE |
Fly line |
MARK |
Mark |
92 |
35 |
ERROR_MARK |
Error mark |
ERROR |
Error |
MARK |
Mark |